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聚酰亚胺系功能膜(TPI Film) - TPI功能膜 - 成都多吉昌新材料股份有限公司
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产品名称:

聚酰亚胺系功能膜(TPI Film)

Description

Chengdu DO-ITC TPI BONDPLY (hereafter TPI) is a flexible adhesive material, whose
both sides have excellent adhesion on micro-etched copper and polyimide-based
material. With low resin flow, outstanding punching property and drilling
performance, it can be applied to the preparation of thicker board and dielectric
layer of substrate, the combination of multi-layer printed circuit boards.

Applications

Chengdu DO-ITC TPI, featured with outstanding strength and modulus, excellent
chemical resistance, thermal resistance, adhesive strength, flame retardancy and
good processability, can be used in the high-end electronics sector:
1. Full-PI Printed Circuit Boards, which will satisfy the demand of ultrathin, high
density, high flatness and multifunction.
2. High-end Rigid-Flex (hereafter R-F) products, specifically for the combination of
multi-layers and the protection of circuit. It can not only raise the heat resistance
of R-F products, but also simplify the procedures of manufacturing.
3. Multi-layer Flexible Printed Circuit Boards.
4. Bond fly, which is also applicable to the Li-battery board.
5. Thickening for high-end functional films, i.e. thicker board, thicker polyimide film,
which is usually applied in aerospace and military industry.
6. Embedded integrated circuits, specifically for the preparation of the units of
embedded passives.

聚酰亚胺系功能膜(TPI Film)

聚酰亚胺系功能膜(TPI Film)Packaging

Chengdu DO-ITC TPI is supplied in a roll form, which is rolling by a 6 inch diameter
PVC hollow pipe, packing with a PE bag. And a 30 g desiccant is attached then the air
in the bag is pumped out. Finally, the product is placed in a 60cm 24cm 24cm
carton box. Other widths and lengths of the package or the product are also available
upon request.

聚酰亚胺系功能膜(TPI Film)

聚酰亚胺系功能膜(TPI Film)

Quick Press/Lamination Recommendations

1.Quick Press
Recommended pressing temperature:190~200°C;recommended pre-pressing time:
20~30S; recommended pressing time: 180~240S. Curing using an oven: Stage1 at
140~150°C for1~2h; Stage2 at 170°C for at least 2h.

Table 2.Recommended parameter of pressing and curing

聚酰亚胺系功能膜(TPI Film)

2.Lamination
In the following situation, lamination can be used:
a. After the quick press above mention(without the curing process).
b. When TPI films and FR-4 pre-pregs are exist at the same time as follows:

聚酰亚胺系功能膜(TPI Film)聚酰亚胺系功能膜(TPI Film)

Note: The temperature above mentioned (in “2. Lamination”) is not the setting
temperature, but the material temperature.


Storage Conditions & Shelf Life


The Chengdu DO-ITC TPI does not require refrigeration and will retain their original
properties for 3 month when stored in the original packaging at temperatures of
5~30 °C and below 70% relative humidity. However, if the TPI is stored in a cool
storage room, standing at room temperature for 2~4 h has to be done before use.
When the package is opened, the product should be used as soon as possible.

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